LOW TEMPERATURE RECOMBINATION INTO SHALLOW DONORS IN GERMANIUM TRANSIENT CASE
| dc.contributor.author | PICKIN, W | |
| dc.date.accessioned | 2026-05-28T15:47:03Z | |
| dc.date.issued | 1950 | |
| dc.description.paginacion | 1299 - 1303 | |
| dc.description.procedencia | EXT | |
| dc.format.discurso | Artículo | |
| dc.format.extent | 5 | |
| dc.identifier.issn | 0038-1101 | |
| dc.identifier.uri | https://ahcm.cinvestav.mx/handle/ahcm/18315 | |
| dc.language.iso | Inglés | |
| dc.numero.secuencia | 18312 | |
| dc.publisher | UNIV NACL AUTONOMA MEXICO,ESCUELA NACL ESTUDIOS PROFESIONALES CUAUTITLAN,MEXICO CITY 20,MEXICO | |
| dc.relation.ispartofseries | Vol. 21 No. 40189 | |
| dc.source.revistafuente | SOLID STATE ELECTRONICS | |
| dc.subject | LOWTEMPERATURE RECOMBINATION, SHALLOW DONORS, GERMANIUM TRANSIENT CASE | |
| dc.subject.categoriaprincipal | CIENCIAS TECNOLOGICAS | |
| dc.subject.disciplina | TECNOLOGIA ELECTRONICA | |
| dc.title | LOW TEMPERATURE RECOMBINATION INTO SHALLOW DONORS IN GERMANIUM TRANSIENT CASE | |
| dc.title.alternative | SOLID STATE ELECTRON |
